The semiconductor industry is rapidly evolving as modern electronic systems demand faster processing speeds, higher energy efficiency, and improved thermal stability. Gallium nitride (GaN) has emerged as a breakthrough semiconductor material capable of delivering superior performance compared to traditional silicon technologies. GaN devices operate efficiently at higher voltages, frequencies,...

According to a new report from Intel Market Research, the global RF GaN device market was valued at USD 1.45 billion in 2025 and is projected to reach USD 3.89 billion by 2034, growing at a robust CAGR of 11.7% during the forecast period (2026–2034). This expansion is propelled by soaring demand for high‑efficiency power solutions in 5G and upcoming 6G networks, accelerated adoption in...

Global Refractory Metal (Mo, W, Nb, Ta) Thin Foil for Electronics market size was valued at USD 1.84 billion in 2025. The market is projected to grow from USD 1.97 billion in 2026 to USD 3.62 billion by 2034, exhibiting a CAGR of 7.0% during the forecast period. Refractory metal thin foils — encompassing molybdenum (Mo), tungsten (W), niobium (Nb), and tantalum (Ta) — are...

Global Thermally Conductive Gap Filler (Elastomeric) for Power Electronics market size was valued at USD 1.43 billion in 2025. The market is projected to grow from USD 1.55 billion in 2026 to USD 3.12 billion by 2034, exhibiting a remarkable CAGR of 8.1% during the forecast period. Thermally conductive gap fillers (elastomeric) are soft, conformable thermal interface materials engineered to...